Special machines

Our special machines give you the possibility to connect several processsing steps in a linear or circular way.

Therefor it is possible to build up fully automatic systems where workpiece feeding, grinding, lapping and polishing are connected to each other as well as cleaning, drying, deburring and demagnetizing.

These machines offer highest processing times and stability.

LPA (Circular)

Model
LPA

Version

Floor model

Working wheel - Ø (mm)
380

Sample holder
Ø (mm)
140

No. of conditioning rings
6

Power (kW)
5

Voltage (Volt)
380

Dimensions (mm)
2700x2700x2100

Weight (kg)
2000

Framework
V2A / aluminium profile

Control unit
Siemens S7 incl. Touchscreen for all Workstations

LPA (Linear)

Model
LPA

Version

Floor model

Working wheel - Ø (mm)
380

Specimen holder
Ø (mm)
150

Power (kW)
5

Voltage (Volt)
380

Dimensions (mm)
600x3000x1800

Weight (kg)
950

Framework
V2A

Control unit
Siemens S7 incl. Touchscreen for all Workstations

ELAP/S 400

Model ELAP/S 400-38

Version
Floor model

Working wheel - Ø (mm) 380 (15“)

Conditioning ring inside
Ø (mm) 140

No. of conditioning rings 3

Power (kW) 0,75

Voltage (Volt) 380

Dimensions (mm) 1960x990x990

Weight (kg) 1000

Rotation speed control
(rpm) 20-60

Framework V2A

Special features Housing

ELAP 700

Model ELAP 700-40 P

Version
Floor model

Working wheel - Ø (mm) 400

Conditioning ring inside
Ø (mm) 160

No. of conditioning rings 1

Power (kW) 2,2 + 0,55

Voltage (Volt) 380

Dimensions (mm) 1300x1160x1100

Weight (kg) 720

Rotation speed control
(rpm) 10-100

Framework V2A

Special features purpose-built for wafers

design: kreative-medien.de